T113S3 Embedded Board
Cost-optimised dual-core Cortex-A7 embedded board with in-package DDR3, RGB/LVDS output and a 7-year Linux BSP.
Quad Cortex-A55 industrial board with dual Gigabit Ethernet, dual CAN-FD and a 10-year supply commitment.
Evaluation units ship in 5 working days. Customised variants quoted within 3 working days of receiving your requirement.
The RK3568 board is the workhorse of our embedded computing line — the platform customers choose when a project needs to run unattended for years and still be maintainable five kernel releases from now.
Dual Gigabit Ethernet makes it a natural protocol gateway between a machine network and a plant network. Dual CAN-FD, four serial ports and PCIe 3.0 cover the rest of the industrial connectivity checklist without daughterboards.
Every unit is burned in for 24 hours at temperature before shipment through our manufacturing partners, and every software release is archived with its exact toolchain so a build from 2026 can be reproduced bit-for-bit in 2032.
Roughly three times the integer throughput of a typical Cortex-A7 HMI board, with a Mali-G52 GPU for OpenGL ES 3.2 interfaces.
Two independent MACs allow true network segmentation between the OT machine network and the IT plant network.
Native CAN-FD controllers plus isolation-ready RS485 and RS232 channels for mixed legacy and modern fieldbus environments.
PCIe 3.0 x1, PCIe 2.0 x1, SATA 3.0, M.2 B-key for 4G/5G and M.2 M-key for NVMe — all on the base board.
Enough for anomaly detection, predictive-maintenance models and OCR at the edge without moving to a larger platform.
Rockchip has committed RK3568 supply into the next decade; we mirror that with PCN discipline and buffer stock.
Standard configuration shown. Memory, storage, interface population, operating temperature grade and board outline can all be changed for OEM builds.
| Processor | Rockchip RK3568, quad-core Arm Cortex-A55 @ 2.0 GHz, 22 nm |
|---|---|
| GPU | Arm Mali-G52 2EE, OpenGL ES 3.2, Vulkan 1.1, OpenCL 2.0 |
| NPU | 1 TOPS INT8, RKNN toolkit 2.x (ONNX / PyTorch / TensorFlow / Caffe) |
| Memory | 2 GB / 4 GB / 8 GB LPDDR4 or LPDDR4X |
| Storage | 16-128 GB eMMC 5.1, SATA 3.0, M.2 M-key NVMe, microSD |
| Display | HDMI 2.0 (4K@60), dual-channel LVDS, MIPI-DSI, eDP - up to 3 simultaneous outputs |
| Camera | 2 x MIPI CSI-2 (4-lane) with ISP, up to 8 MP |
| Ethernet | 2 x 10/100/1000 Mbps, IEEE 1588 support |
| Fieldbus | 2 x CAN-FD, 4 x UART (2 x RS485-ready), I2C, SPI, PWM, 12 x GPIO |
| USB | 1 x USB 3.0 host, 3 x USB 2.0, 1 x USB Type-C OTG |
| Expansion | PCIe 3.0 x1, PCIe 2.0 x1, M.2 B-key (4G/5G + SIM), M.2 E-key (Wi-Fi/BT) |
| Audio | 3.5 mm line out, I2S, digital microphone array interface |
| Operating system | Debian 12, Ubuntu 22.04, Yocto Scarthgap, Buildroot, Android 11 |
| Power | 12-36 V DC wide input, 6.5 W typical / 14 W peak |
| Operating temperature | -40 C to +85 C industrial grade |
| Dimensions | 146 x 102 mm (3.5" SBC form factor); Pico-ITX and SoM variants available |
| Reliability | MTBF > 150,000 h at 40 C, 24 h burn-in on every unit |
Need the full datasheet, 3D STEP model or a test report? Request them with your quote and we will send them the same day.
Cost-optimised dual-core Cortex-A7 embedded board with in-package DDR3, RGB/LVDS output and a 7-year Linux BSP.
Integrated smart-display SoC with on-chip TCON — one board drives the panel, the touch and the application logic.
Quad Cortex-A55 embedded board with an on-chip NPU and dual camera inputs — interface and inference on one board.
Every platform on this site started as a customer-specific design. Ours is a customisation business that happens to keep a standard catalogue.
Re-layout to Pico-ITX, 3.5", or a fully custom outline including your connector faceplate.
Use the RK3568 as a system-on-module and let us design the carrier board around your I/O requirements.
IPC-A-610 Class 3 assembly with acrylic or silicone coating for condensing and marine environments.
Contracted kernel CVE patching and quarterly release notes for the life of your product.
Volume programmes managed through qualified China manufacturing partners with AOI, X-ray, ICT and FCT.
Send the panel size, interface list, temperature range and target volume. You will get a configuration, a price and a lead time — from an engineer, within one business day.
Your message goes directly to the application engineer responsible for this platform.